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AMIA Labs uses x-ray microanalysis to characterize either a small amount of material or a spot on a larger piece of material. For example a specific area on a rock or a structure on a petterned wafer. The same XRD analysis are used after data collection using microdiffraction data as in standard diffraction. Some of these analases are phase identification, texture, stress, and crystallite size.

One of the most challanging problems is to obtain reliable percent crystallinity from oriented polymeric materials without chopping up a sample which could change the property under investigation. Utilizaing a 2D detector and a rocking technique, AMIA Labs has developed a method of  determining the percent crystallinity from oriented materials

Stress, and normal micro-strain can influence product reliability. Mechanical stresses in interconnect lines, which arise from differences in thermal expansion between the metallic interconnect and the substrate that rigidly confines it, vary with different fabrication methods and aspect ratios. AMIA Laboratories has developed micro-beam stress techniques to characterize features as small as 50 µm on patterned wafers. Strain measurements on blanket films are also available.

Unlike conventional x-ray diffraction, microdiffraction uses a very small beam to illuminate a small area. This application involves measuring stress on a wire. This technique developed by AMIA Labs can even detect a small stress variation due to a defective die.